To ensure a press-in connection lasts the lifespan of the device, IEC 60352-5 defines strict boundaries for both the components and the assembly process. 1. Printed Circuit Board (PCB) Specifications
: Monitoring contact resistance to ensure high-quality signal and power transmission. Environmental
Previously, the testing scheme discarded a large number of test samples. The new edition reduces the required number of specimens, saving time and cost without compromising statistical confidence.
Tests the "gas-tightness" of the connection. A gas-tight connection prevents oxygen and corrosive gases from entering the contact zone, preventing oxidation. iec 60352-5 pdf
Editorial changes now clearly distinguish between the qualification test schedule (what you do once, to qualify the pin‑to‑hole system) and the application test schedule (verification for a specific product). This avoids confusion seen in earlier revisions.
: It outlines tests for mechanical strength, including tensile strength and vibration resistance, to ensure that the connections can withstand mechanical stresses.
IEC 60352-5 is the international standard that covers crimped and solderless electrical connections — specifically methods, requirements, and test procedures for reliable, low-resistance joints used in wiring and component terminations. For engineers, technicians, and hobbyists working with connectors, terminals, and wiring harnesses, knowing this standard helps ensure safety, durability, and consistent performance across products and installations. To ensure a press-in connection lasts the lifespan
The IEC 60352-5 standard is an indispensable tool for anyone involved in designing, manufacturing, or testing solderless press-in connections. It provides a globally recognized foundation for quality, reliability, and performance.
: Press-fit technology is noted for being significantly more reliable than traditional soldering in high-stress environments. Recent Changes in Edition 5.0 (2020)
The primary global source for purchasing individual standards or site licenses. A gas-tight connection prevents oxygen and corrosive gases
The represented a major technical revision. Compared to the 2008 edition, it deleted all tables with hole dimensions (because those dimensions were historically inherited from obsolete wire‑wrapping technology), added a full Annex A with practical application notes, included extra figures and a table to define tolerance ranges for test‑board holes, and introduced a requirement for the thickness of the test‑board.
Knowing these details will allow us to target the exact manufacturing tolerances you need. Share public link
Provides a means of comparing results even when using tools from different manufacturers. IEC Webstore Key Technical Requirements Requirement Details Mechanical Procedures for measuring press-in force push-out force
The standard sets strict tolerances for the PCB hole before and after plating.